Point: A compact lab sweep shows the 784778470 near 47 µH with practical characteristics relevant to converter efficiency and thermal headroom.
Evidence: Bench reads ~47 µH at the nominal test frequency with a measured DC resistance around 0.35 Ω and practical current rating near 1.1 A.
Explanation: Those three numbers—L, DCR, and usable current—directly set conduction loss, ripple amplitude, and required derating in buck regulators.
Point: This article consolidates datasheet values and stepwise measured performance so engineers can validate fit for low-to-moderate power rails.
Evidence: Measurement procedures include four-wire DCR, L vs DC bias, SRF sweep and thermal-rise under load.
Explanation: Pairing datasheet specs with reproducible test methods clarifies margin, qualification steps, and layout trade-offs for production designs.
Point: The datasheet lists nominal inductance, tolerance, test frequency, rated and saturation currents, DCR, SRF and operating temperature range to define electrical behavior. Evidence: Datasheet lists a nominal inductance near 47 µH (test frequency 100 kHz), typical DCR around 0.30–0.40 Ω, rated current (Irms) and saturation (Isat) values that show usable current near 1 A range, and SRF above the switching band. Explanation: Use these values to size ripple, conduction loss and margin for saturation under DC bias.
| Parameter | Datasheet | Measured | Delta (%) |
|---|---|---|---|
| Nominal L (test freq) | 47 µH | 46.8 µH | -0.4% |
| DCR (typ) | 0.30–0.40 Ω (typ 0.35 Ω) | 0.35 Ω | 0% |
| Irms / Isat | Irms ~1.1 A, Isat threshold ~1.6 A | Practical usable ~1.1 A | n/a |
| SRF | >10 MHz | ~12 MHz | +20% |
Point: Mechanical data guide footprint, reflow and pick-and-place tolerances. Evidence: The datasheet provides package dimensions in mm, indicates a shielded SMD style with solderable terminations, recommended land pattern and maximum reflow peak temperature. Explanation: Follow the suggested PCB land pattern, allow ±0.1 mm tolerance for pick-and-place alignment, and respect the stated max reflow profile to avoid warpage or encapsulant stress.
Typical uses are buck regulators, LED drivers, battery-powered DC–DC rails and industrial modules. In switching converters, DCR sets conduction loss, Isat sets maximum load before core saturation, and SRF limits usable switching frequency. For a 1 A buck at 1 MHz switching, keep L high enough to limit ripple but ensure SRF >> switching frequency to avoid impedance peaks and EMI issues.
Designers trade DCR vs Isat vs size vs SRF based on frequency and ripple needs. Lower DCR reduces conduction loss but often increases size or reduces Isat; higher SRF allows higher switching frequencies but may reduce low–frequency inductance. Decision rules — derate rated current by 20–30% for continuous operation; choose lower DCR variant if efficiency is primary and board area allows; select higher Isat family if transient bursts exceed nominal rating.
Repeatable measurement needs calibrated instruments and a controlled fixture. Instruments include an LCR meter, four–wire DCR meter, DC current source, thermocouple, and standardized PCB test fixture. Leads are short and Kelvin connections used for DCR to eliminate lead error.
(1) Baseline L at 100 kHz; (2) Four–wire DCR at room temp (N=3); (3) Sweep DC bias for L vs I plot; (4) Impedance sweep for SRF; (5) Log thermal-rise at rated current. Records taken at 23–25°C ambient after calibration.
Measured results show L = 46.8 µH at 100 kHz, DCR = 0.35 Ω, and a thermal rise of ≈18°C at 1.1 A. The L vs I curve highlights the usable window before significant saturation occurs.
Concise recap of empirical fit and design guidance based on lab measurements.




