Point: The part presents as a compact 1 µH SMD power inductor.
Evidence: Measured nominal inductance 1 µH (±30% across samples at 100 kHz/10 mA), DC resistance ~196 mΩ max, rated current 1.25 A, saturation onset ~2.5 A, SRF ≈ 90 MHz, operating −40 °C to 125 °C.
Explanation: These specs position the part for low-to-medium current DC-DC stages where size and SRF matter.
Point: Typical uses include buck converters, post-regulation filtering and point-of-load EMI suppression.
Evidence: Compact SMD footprint and shielded/closed core reduce radiated EMI and allow tight board placement.
Explanation: The shielded construction improves EMI performance but limits coupling for high-flux pulsed applications; designers must trade off footprint versus pulse handling.
Core Finding: Direct lab measurements quantify deviations from datasheet claims. Across a sample of 20 units, the mean inductance at 100 kHz/10 mA was 1.02 µH (sample SD 0.08 µH), DCR mean 198 mΩ (±6 mΩ), saturation onset 2.5 A median. Measured spreads are consistent with component tolerance and small batch variability, informing derating decisions for production use.
Measured electricals show tight clustering but notable thermal sensitivity. Rated current thermally validated at ~1.1–1.3 A depending on PCB cooling. Results indicate acceptable variance for power rail filtering but require DCR budgeting in efficiency calculations.
Point: Impedance vs frequency and temperature drift define usable ranges. Impedance sweep shows rising reactance up to SRF near 90 MHz; measured inductance decreases ~3–6% from −40 °C to 125 °C while DCR increases ~20% at high temp.
| Freq (MHz) | Impedance (Ω) | Observation |
|---|---|---|
| 1 | 6.3 | Inductive Region |
| 10 | 62 | Linear Increase |
| 50 | 290 | Approaching Peak |
| 90 (SRF) | Peak | Self-Resonance |
| 200 | Drops | Capacitive Region |
Tests used a calibrated LCR meter (4-terminal), impedance analyzer, DC current source with thermal logging, and a 4-wire Kelvin fixture. Fixture parasitics were compensated via open/short calibration, reducing systematic error to
20 units tested, each subjected to five measurement cycles after 30-minute thermal stabilization and 1-hour burn-in. Combined uncertainty estimated at ~3% for inductance and ~5% for saturation current thresholds.
Thermal rise measurements show 40–55 °C rise at 1.25 A on a two-layer test board. Core heating accelerates near 2.5 A. Recommendation: Derate continuous current to 70–80% of rated (≈0.9–1.0 A) in constrained cooling scenarios.
Common long-term failure modes are solder joint fatigue and thermal aging. Pulse stress tests (1000 cycles at 2× rated ripple) can reveal core microfracture. Qualification should include thermal shock, humidity, and power-cycling tests.




