In modern compact DC–DC converters, designers commonly pick inductors rated for >3 A with low DC resistance to cut I²R losses and preserve thermal headroom; survey data from board-level designs shows such choices in a large share of high-efficiency rails. This article dissects the 7847709470 inductor datasheet to extract actionable specs designers need: read a datasheet confidently, calculate loss and saturation margins, and match the part to an application.
Point: The part is a compact, shielded SMD wirewound-style power inductor with a nominal inductance suitable for intermediate-frequency buck converters.
Evidence: The datasheet lists a nominal value around 47 µH with typical shielded drum-core winding hints and an SMD package footprint.
Explanation: That form factor favors PCB space savings and lower radiated EMI, making it suitable for buck converters, LC output filters, power rails, and EMI suppression in space-constrained boards; designers should scan the datasheet to confirm package and mounting notes.
Point: Selection drivers in US designs center on efficiency, thermal limits, board area, and EMI compliance.
Evidence: Engineers prioritize Isat/Irms, RDC, L tolerance, and SRF when validating parts against system targets.
Explanation: Low RDC minimizes I²R loss, adequate Isat prevents inductance collapse under peak current, tight tolerance keeps filter cutoffs predictable, and SRF determines usable frequency range—each directly impacts efficiency, thermal budget, and EMI margins on regulated products.
Point: Nominal inductance, tolerance, RDC, and SRF are the primary numbers that define in-band behavior.
Evidence: A 47 µH nominal value with ±20% tolerance shifts filter corner frequency; RDC values on similar parts sit near 60–70 mΩ.
Explanation: A ±20% tolerance changes cutoff by the square root of the inductance ratio; RDC produces I²R loss and sets copper heating, while SRF and parasitic C tell you when inductance no longer behaves inductively.
Point: Irms (thermal), Isat (inductance collapse), and maximum DC current define usable current range.
Evidence: Datasheets give Irms for a specified ΔT, Isat as L drop at a defined percentage (e.g., 20% L drop), plus curves of L vs. DC current.
Explanation: Compute saturation margin as (Isat - I_operating) / I_operating; target 20–30% for normal ambient, and increase margin in high-temperature environments.
P_loss ≈ I_rms² × RDC
Example: With RDC = 0.067 Ω and I_rms = 2.5 A, P_loss = (2.5)² × 0.067 ≈ 0.42 W. Add core loss (~0.05–0.1 W) to estimate total heating.
A shielded designation implies reduced external flux. If SRF is within 5× the switching frequency, HF impedance degrades—switch to a different core or lower inductance.
| Spec | Why it Matters |
|---|---|
| Nominal L & Tolerance | Sets filter cutoff and margin for expected variation. |
| RDC (typ/max) | Directly drives I²R loss and PCB thermal planning. |
| Isat / Irms | Ensures inductance holds under peak and thermal loads. |
| SRF / Test Freq | Defines high-frequency usable range and parasitic effects. |
| Package / Reflow | Determines footprint and assembly compatibility. |
Decision flow for 7847709470 inductor alternatives:




